Nanotechnology pushes the frontiers of sensor technology!

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Future trends in semiconductor and sensor technology foresee the assembly and integration of devices at multiple levels, ranging from nano- to micro- and macroscale. The nanoscale provides enhanced performance, the microscale implements various material platforms to achieve a broad range of functionalities, and the macroscale enables interaction with the real world.

Heterogeneous Integration (HI) is the formula to bridge the gap between the nanoscale with its great variety of materials and novel properties, and systems that humans can interact with.

The objective of HI is the ”More than Moore” integration of different functionalities ranging from sensors and signal processors to photonics or energy into a single package.

The challenge of HI is the implementation of components with basically incompatible manufacturing technology into a single device.

The key to HI is the combination of an increasingly wider set of expertise, ranging from microelectronics, sensors & actuators to the bio-nano convergence domain. 

HETEROGENEOUS INTEGRATION
Heterogeneous Integration implements multifunctional components based on different technologies and materials into a single package. Heterogeneous Integration includes nano-, bio-, and biomimetic technologies and closes the gap between the world of nanodevices and systems that humans can interact with.

NANOSENSORS FOR BIOMEDICAL AND ENVIRONMENTAL APPLICATIONS
Nanosensors are smaller, more sensitive, demand less power, and react faster than their macroscopic counterparts. The heterogeneous integration of nanosensors opens the door to new biomedical and environmental applications.

FUNCTIONAL LAYERED SYSTEMS
Complex layered systems add more functionality and increase performance in a large variety of industrial applications. Functiona l layered systems are based on novel alternative materials and processes which have to be adapted to standard semiconductor technology.

3D-SYSTEM INTEGRATION
Compatibility with today’s silicon technology is presently the key for the acceptance and realization in specialized microelectronic fabs. 3D-systems, can integrate heterogeneous components such as functional layers, sensors & actuators, μ-fluidics & μ-pumps, optical interconnects, heating systems, and nano-objects.